2D/3D Solder Paste Inspection System

Model: 
BPC-SX2

The intuitive programming, the stable construction and the process related inspection algorithms are a useful help for process monitoring.

The SPC-Software is a reliable tool for the printing quality analysis and for the production status control.

Catalog: 
application/pdf icondjtech-bpc-sx2_en.pdf 1.22 MB
Features: 
  • High accuracy
  • No blind spots
  • Automatic resolution switch
  • Automatic program creation
  • Double speed inspection by quick scanning
    • 2D/3D normal mode: 4,750mm2/sec
    • 2D/3D high-speed mode: 8,200mm2/sec
  • New! Optical 2D/3D/ axis real-time control
  • Special lighting for green/blue PC boards
  • Multiple slit lighting
    • no pixel shift or ghost image
General specifications: 
PCB size 510 x 460 - 50 x 50mm
t= 0.3 - 4.0mm
Inspection time Standard mode: 4,750mm2/sec
High speed mode: 9,500mm2/sec
High resolution mode: 1,000mm2/sec
Lighting Slit lighting
Inspection item Area, shifting, bridge, balance, volume, average height, sectional area, projection area, peak height
Resolution Standard resolution: 24.0m
High resolution: 12.0m
Min. component size 0.15mm pitch CSP, 0402 chip (mm UNIT)
Max. height 0.6mm
Lens Terecentric lens
Max. PCB wrap +-5mm
Dimensions 1,100(W) x 1,200(D) x 1,400(H, excluding display)