Thermal shock chambers

  • Thermal Shock Chamber (air to air)

    Model: 
    TSA Series

    TSA Thermal Shock Chambers offer totally new performance and style. Shortened temperature recovery time and temperature rise and fall times, reduced power consumption, the use of HFC refrigerants.

  • Thermal Shock Chamber TSD-100

    Model: 
    TSD-100

    Two-zone thermal shock chamber ideally suited for MIL/IEC/JASO Japanese and international test standards. This new Thermal Shock Chamber from ESPEC is capable of subjecting specimens to uniform thermal stress with a 100 L test area and outstanding thermal distribution characteristics, making them ideally suited for use in a wide range of applications from research and development to inspection and production.

  • Thermal Shock Chamber (liquid to liquid)

    Model: 
    TSB Series

    High accuracy is increasingly demanded in the pursuit of reliability in the field of electronics.

    "Liquid-to-liquid" type thermal shock testing is now attracting attention for its ability to impose higher thermal stress on specimens than "air-to-air" type testing, and to deliver test results quickly.

  • Compact Thermal Shock Chambers (Air to Air)

    Model: 
    TSE

    Equipped with superior temperature recovery performance capable of answering the requirements of strict test specifications, this thermal shock model offers a wide test area in a compact, slim design.

  • Thermal Shock Chamber with Humidity

    Model: 
    TSA-D-W

    Notebook PC, mobile phones, automobile electronics are exposed to sudden temperature changes because they are moved from outdoor to indoor and vise versa.