Thermal Shock Chamber with Humidity

Model: 
TSA-D-W

Notebook PC, mobile phones, automobile electronics are exposed to sudden temperature changes because they are moved from outdoor to indoor and vise versa.

It is necessary to conduct thermal shock cycle test with sudden change between high and low temperatures. Also dew condensation is a big issue. The dew condensation effects performances and functions of electronics equipment causing corrosion, migration and malfunctions. The dew condensation test is important for checking these conditions. By using newly developed thermal shock chamber with humidity, you can save space and cost because only one chamber is required.

Catalog: 
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Features: 
  • New type thermal shock chamber
  • Thermal shock cycle test functions
  • Equivalent functions to humidity cycle test chamber
General specifications: 
Model TSA-101D-W TSA-201D-W
Power supply 200V AC, 3ø 3W 50/60Hz
System 2-zone and 3-zone with damper switching
Specimen basket withstand load 5kg(Evenly distributed load)
Test area dimensions W650 × H460 × D370mm W650 × H460 × D670mm
Chamber outer dimensions W1670 × H1900 × D1570mm
(excluding protrusions)		 W1670 × H1900 × D1870mm
(excluding protrusions)
Chamber weight About 1300 kg About 1550 kg

 

Performance

At ambient temperature of 23 °C

Test area*1 High temp. exposure temp. range 1. Thermal shock cycle test +70°C to +150°C
2. Dew condensation cycle test -10°C to +100°C
Low temp. exposure temp. range -70°C to +10°C
Temperature fluctuation ± 1°C
Humidity fluctuation ± 5% rh
High temperature and
humidity chamber
(stand-alone performance)		 Pre-heating temp. limit +150°C
Humidity range 40 to 95% rh
(at dew condensation cycle test)
Temp. heat-up rate Within 30 min. from -10°C to +100°C
Temp. pull-down rate Within 60 min. from +20°C to -10°C
Low temperature chamber
(stand-alone performance)		 Pre-cooling temp. limit -75°C
Temp. heat-up rate Within 30 min. from -75°C to +10°C
Temp. pull-down rate Within 60 min. from ambient temp. to -75°C

*1 The operating performance of dew condensation cycle test needs requirements. Please contact us for details.

Temperature recovery performance

At ambient temperature of +23°C and cooling water temperature of +25°C.

Thermal shock
cycle test		 Recovery conditions
3-zone Low temp. exposure: -65°C (30 min.)
Ambient temp. exposure:
Ambient temperature (10 min.)
High temp. exposure: +150°C (30 min.)

Power supply : specified power supply
Sensor position: Upstream of specimen
Specimen: Plastic mold IC 5kg Specimen: Plastic mold IC 10kg
Recovery time High temp. recovery: within 10 min.
(ambient temp. to
+150°C),
Low temp. recovery: within 10 min.
(ambient temp. to -65°C)		 High temp. recovery: within 16 min.
(ambient temp. to
+150°C),
Low temp. recovery: within 16 min.
(ambient temp. to -65°C)
Dew condensation
cycle test 1		 Recovery conditions
2-zone Low temp. exposure:
+5°C (20 min.)
High temp. and humidity exposure:
+25°C 90% (20 min.)

Power supply : specified power supply
Sensor position: Upstream of specimen
Specimen: PCB 2kg Specimen: PCB 5kg
Recovery time*2 High temp. recovery: within 20 sec,
(+5°C→ +25°C 90%)
Low temp. recovery: within 3 min.
(+25°C 90% rh → +5°C)		 High temp. recovery: within 20 sec,
(+5°C→ +25°C 90%)
Low temp. recovery: within 5 min.
(+25°C 90% rh → +5°C)
Dew condensation cycle test 2 Recovery conditions*3
2-zone Low temp. exposure:
-30°C(60 min.)
High temp. and humidity exposure:
+25°C 95%(60 min.)
*Preheat temp.25°C 95%

Power supply: specified power supply
Sensor position: Upstream of specimen
Specimen: none
Recovery time*2 High temp. and humidity recovery: within 5 min.
(-30°C→ +25°C 95%)
Low temp. and humidity recovery:within 5 min.
(+25°C 95% rh → -30°C)

*2 Performance at temperature only.
*3 Defrost by cycle defrosting is required in every 12 cycles.