Thermal Shock Chamber (liquid to liquid)

Model: 
TSB Series

High accuracy is increasingly demanded in the pursuit of reliability in the field of electronics.

"Liquid-to-liquid" type thermal shock testing is now attracting attention for its ability to impose higher thermal stress on specimens than "air-to-air" type testing, and to deliver test results quickly.

ESPEC has successfully developed next-generation liquid-to-liquid thermal shock chambers that satisfy the demand for environmental conservation and lower running costs from brine and power consumption, which have traditionally been regarded as stumbling blocks with liquid-to-liquid thermal shock chambers.

Catalog: 
application/pdf iconespec_tsb_en.pdf 528.06 KB
Features: 
  • Less brine consumption
  • Single- or double-liquid brine selectable
  • Improved visibility usability
  • Energy saving
  • HFC refrigerant
General specifications: 
Model Power supply Temperature range Specimen basket dimensions
W×H×D (mm)
TSB-21 200V AC
3ø, 3W, 50/60Hz		 Hot bath: +70 to +200°C
Cold bath: -65 to 0°C		 120 × 150 × 120
TSB-51 150 × 150 × 200